Bitspower Zenith ZT-X1 Thermal Paste(5G)

The Bitspower Zenith ZT-X1 is a non-silicone thermal paste engineered around the measurement that determines real-world cooling: thermal impedance. Rated as low as 0.048 K-cm²/W and tested to the ASTM D5470 standard, the ZT-X1 forms a 25-micron bond line under mounting pressure for maximum contact between die and cold plate. This is where the Zenith series focuses its engineering, at the interface itself, where performance is actually decided.

Application is straightforward. The ZT-X1 spreads smoothly and evenly on the first pass, with no burn-in period and no cure time, delivering full performance from the first mount. The formulation is silicone and solvent free with zero detectable siloxane content, so nothing outgasses or migrates onto surrounding components. Resistance to dry-out and pump-out is verified through accelerated stress testing: three months at 85°C and 90% relative humidity, with less than 0.1% weight loss after 240 hours of sustained heat. The performance you measure on day one holds over years of service.

◇Key Features◇
．Ultra-Low Thermal Impedance: As low as 0.048 K-cm²/W (ASTM D5470), the measurement that directly determines cooling performance at the interface.
．Easy Application: Smooth, even-spreading consistency with no burn-in time or cure period. Full performance from the first mount.
．Silicone and Solvent Free: Zero detectable siloxane content. No outgassing or migration onto surrounding components.
．Verified Long-Term Stability: HAST-certified through three months at 85°C / 90% RH, with less than 0.1% weight loss after 240 hours of sustained heat.
．Electrically Non-Conductive: Safe to apply around exposed traces and SMD components.
．Two Sizes Available: 2.5g and 5g syringes.